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Pioneer 5G Thermal Solution

Date:2020-08-04 

Heat Sink manufacturers design and supply the 5G thermal solution is a trend now.

With greater data transmission, 5G networks will not only serve mobile phones, but after connecting more smart devices, such as shared bicycles, smart cars, smart cameras, smart door locks, smart lighting, etc., society will enter the IoT era. The low latency of 5G makes it possible for smart manufacturing factories, unmanned driving, and remote high-definition medical operations.

 

5G develop Pioneer Thermal
 

There are currently 26 pieces 5G networks in the world, and it may increase to 60 by 2020. Only China will have 1 million 5G base stations by 2020.


In order to better solve the heat dissipation problem of 5G base stations and supercomputing centers, the PioneerThermal R&D team strives for perfection and ingenuity, breaking the traditional thinking of cooling solutions, and innovatively developed liquid cooling for 5G base stations and supercomputing centers. Cooling module. Through structural design, thermal simulation analysis, actual measurement verification, and continuous optimization and improvement of the flow channel and temperature field, a successful product is finally developed.

The heat sink dissipation power of a single CPU is 100W-300W, the temperature difference between inlet and outlet is 1-5℃, and the pressure drop is 5-20kPa.

For the improvement of the temperature uniformity performance of the 5G base station housing, the aluminum uniform temperature plate was developed, which realizes the temperature uniformity function through the internal phase change working medium, and the cost is much lower than that of the copper uniform temperature plate, and at the same time, the large area uniform temperature effect can be achieved.

Pioneer 5G Thermal Solution

In addition to the research and development of the 5G base station and the liquid-cooled heat sink dissipation module of the supercomputer center, the Pioneer Thermal R&D team is also conducting continuous technical research and exploration in the field of heat dissipation technology for new energy vehicles. At the same time, we also go deep into the microscopic world and avoid the surface of the radiator corrosion problem.

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