Board Level Stamped Heat Sinks Solution

The board level stamped heat sinks solution is a series of technical means designed to meet the heat dissipation needs of board-level components in electronic equipment. It aims to efficiently remove heat, ensure that electronic components operate stably in a suitable temperature environment, and prevent overheating from causing performance degradation, shortened life, or even failure.

Stamped heat sinks are a cost-effective solution for increasing surface area to increase heat transfer in board-level products. These heat sinks are formed through a progressive stamping process where details and features are gradually added as each sheet metal stamping passes through the stamping die. Stamped heat sinks are designed for specific electronic package types to ensure optimized fit and function. These heat sinks are available with a variety of mounting methods including solder tabs and pins, interference fit to the device via integrated clips or slide-in features, or through-hole hardware such as screws and nuts. Most stamped heat sinks come with a surface treatment to improve heat radiation and thermal performance for natural convection applications.Board level heat sink is light-weighted and easily soldered or inserted by clips, nuts or adhesive thermal pad onto the Printed Circuit Boards (PCBs), the most cost-effective solution for heat dissipation.
Board Level Stamped Heat Sinks Solution - Pioneer Thermal specialize in the design and manufacturing of high quality, high performance but cost effective heat sink manufacturer.

Board Level Stamped Heat Sinks Solution

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