China Heat Sink Manufacturers To Develop 5G Cooling Products Is A Trend
China Heat Sink Manufacturers To Develop 5G Cooling Products Is A Trend
Date：2020-07-21
The advent of the 5G era has brought development opportunities and new requirements to all walks of life. The electronic heat dissipation industry is no exception. Facing the more severe heat dissipation requirements, it needs more powerful heat sink materials to solve the problems. Electronic products are matched with qualified Only the radiator can gain a firm foothold in the 5G era and steadily exert its strengths.
If you want to make a 5G heat sink that meets your needs, you must first choose a material with a strong thermal conductivity. Metal as a radiator is still very popular among users. It has the gorgeous luster of metal, cool and smooth feel, and it is easier to process a beautiful and shining feeling. However, the local gold, high-end gray, Electronic products with metal casings such as rose gold are very popular. Pioneer Thermal heat sinks breaks through the barriers of cost and technology in material selection, and selects aluminum alloy with a thermal conductivity of up to 201W/MK, which not only meets the visual and hand-feel demand for heat dissipation panels, but also the weight of aluminum alloy is about 1/3 of stainless steel. It is also very affordable and is actually a cost-effective material.
With the guarantee of materials, it is far from enough.Pioneer Thermal heat sinks will also carefully and rigorously shape the products. Precision processing for electronic radiators through CNC machining to cast a radiator with perfect structure and function. After wire drawing, anodizing, electroplating, baking varnish, electroplating coating and other processes, the appearance of the formed radiator is more colorful, bright in color, and clear in texture. It is more high-end with electronic products. The performance is no exception. The hardness, toughness, corrosion resistance, heat conduction and heat dissipation have been improved on the original basis, and the thickness is thinner than before. Aiming at the development of light and thin electronic products in the 5G era, it is obviously a very suitable heat sink material. . In addition, in order to enhance its heat dissipation capability, the heat dissipation panel can be cast into a fin shape under CNC machining, and the heat dissipation capability is improved by increasing the convection area with the air, so as to achieve the purpose of escorting the heat of electronic products.
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