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Heat sink reflow soldering process characteristics
Reflow soldering refers to the process of welding the part of the heat sink in contact with the heat pipe with a thermally conductive material such as solder paste during the welding process, which is an advanced process in the manufacture of heat sinks.
Compared with the traditional FIN-piercing process, the reflow soldering process has higher thermal conductivity efficiency and better heat dissipation fin stability. The reflow soldering process is usually applied to heat sinks made of copper materials, and its principle is to make thin pieces of copper into fins and make good connections with the base. This principle is welding technology.
In heat sink manufacturing, the reflow soldering process offers many advantages, such as the ability to manufacture more precise and stable heat sinks, as the position of the heat sink does not move during the welding process. The reflow soldering process is more complex and costly than the FIN-piercing process, so it is usually only used in high-end expensive heat sinks.
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