For the design of the heat sink, the most important consideration is the heat dissipation performance of the heat sink in a given configuration, including flow properties and geometric layout.
The table below displays selected examples of extruded profiles with preferred design shapes.
Copper has the highest thermal conductivity, but it dissipates heat slowly. The thermal conductivity of aluminum is lower than that of copper. But it dissipates heat faster. Steel can do nothing. In theory, on the radiator, the copper seat is in direct contact with the heating element, and the radiator plate USES aluminum. That's the best. Similarly, the radiator that USES copper completely needs to add fan commonly. And the radiator that uses aluminium does not need to add fan commonly (also can add effect a bit better).
Generally according to the heatsinks processing method, cooling method, application, materials, power and so on.
Extrusions, extruded heat sinks are the most common and cost efficient heat sinks used for thermal management today. A material is pushed through a die of the desired cross-section. The two main advantages of this process over other manufacturing processes are its ability to create very complex cross-sections, and to work materials that are brittle.
The aluminum profile is widely used for its good plasticity, moderate heat treatment strength, good welding performance and gorgeous color after anodization treatment. However, some problems often occur in the production process, resulting in poor quality of radiating aluminum extrusion heat sinks, reduced yield, increased production cost, reduced efficiency, from leading to the enterprise's market competitiveness. Therefore, solving the problem of aluminum profile defects is an important aspect for enterprises to improve their competitiveness. Below editor on sharing heat radiators aluminum profile scratches, scratches, bruising reasons and its solutions.
Recently, two new Tundra RGB series CPU water-cooled heat sinks, TD-02 RGB and TD-03 RGB, have been introduced on the market. The TD-03 RGB uses a 120mm x 120mm single fan design, and the TD-02 RGB uses a 240mm x 120mm dual fan design with a thickness of 32mm. Both support the CPU slots of the LGA115x, LGA2066 and AM4.
At present, one of the biggest technical problems of LED heat sinks is the heat dissipation problem. The LED heat supply and electrolytic capacitors have become the short-term development of LED heat sinks, and the cause of premature aging of LED heatsinks.
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