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IGBT Heat Sink Cooling Design Manufacturer

Date:2024-03-15 

For safe IGBT operation, the junction temperature (Tj) must nev er exceed Tj(max). Therefore, it is necessary to have a IGBT heat sink cooling design capable of keeping the junc tion temperature below Tj(max), even during overload conditions. Pioneer Thermal specializes in the design and manufacturing of high quality, high performance but cost effective heat sinks.
                                                                   Double-Sided Water-Cooled

An IGBT module consists of IGBT chips and FWD chips. The sur m of the power losses from these sections equals the total power loss for the module. Power loss can be cla assified as either on-state loss or switching loss. A diagram of the power loss factors is shown as follows.
                                               Total power loss of IGBT module (Ptotal)
The on-state power loss from the IGBT and FWD sections can be calculated using the output characteristics, while switching loss can be calculated from switching loss vs. collector current characteristics. Use these power loss calculations in order to design cooling sufficient to keep the junction temperature Tj below the maximum rated value. The on-voltage and switching loss values to be used here, are based on the typical junction temperature Tj (125°C or 150°C are recommended). For characteristics data, refer to the module specification sheets.

 
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