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In today's era of rapid technological development, various precision electronic devices such as high-performance computer chips, communication base station equipment, high-end industrial control modules, etc. generate a lot of heat during operation. If the heat cannot be dissipated in a timely and effective manner, it will lead to equipment performance degradation, shortened lifespan, and even malfunction and damage. Therefore, it is crucial to design an efficient and reliable precision heat sink thermal solution.
Heat Sink Design
● Heat sink fin design
Optimize the shape, spacing, and height of the fins. Increasing the fin height can increase the heat dissipation surface area, but too high will increase the airflow resistance and affect the heat dissipation effect; appropriately reducing the fin spacing can increase the number of fins and increase the heat dissipation area, but too small a spacing will hinder the airflow. For example, for air-cooled radiators, the fin spacing is generally between 1mm and 3mm, which is more suitable. The fin height can be determined according to the overall size of the radiator and the heat dissipation requirements, usually between 20mm and 50mm. The use of fins with special shapes, such as corrugated fins or needle fins, can destroy the airflow boundary layer, enhance the turbulence of the air, and improve the heat exchange efficiency.
● Heat pipe layout design
In the scheme of heat dissipation using heat pipes, the position and number of heat pipes should be reasonably arranged. The heat pipe should be as close to the heat source as possible to reduce the length of the heat conduction path and improve the heat conduction efficiency. According to the shape of the heat-generating component and the heat distribution, a single heat pipe or a combination of multiple heat pipes can be used. For example, for a square CPU chip, multiple heat pipes can be evenly arranged around the chip to quickly conduct heat to various parts of the heat sink. For a long heating element, one or more heat pipes can be arranged along its length.
● Overall structural compactness design
Considering the internal space limitations of the equipment, a compact heat sink structure is designed. The integrated design concept is adopted to organically combine the cooling fins, heat pipes, base and other components to reduce unnecessary connection components and space occupation. For example, in the design of a laptop heat sink, the cooling fins and heat pipes are designed as a whole and processed by stamping, welding and other processes, which not only improves the structural strength of the heat sink, but also saves space.
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